Hybrid Yield Modeling
What's a hybrid?
A hybrid is a rigid 3D interconnect circuit board upon which passive and active electronics can be assembled. Passive components include resistors, capacitors, and inductors. Active components have transistors and are typically integrated circuits (ICs). Printed circuit board (PCBB) is another term for hybrid.
Hybrid yield cannot be modeled!
They're not "all in", so maybe you aren't either?
These people are
C'mon, a paper?
Yup, those are the underpinnings of hybrid yield modeling as far as I know. My takeaway was that they analyzed the yields of a group of hybrids using a linear regression. The neat trick was breaking down the hybrid components by type and using these as the linear regression coefficients. When done properly this provided a complexity index, which means that more complex boards are more difficult to assemble. While this concept seems simple, it allows you to quantify yield.
By type?
Right. Both passive and active components can be categorized by process experts as they will fall into natural categories. Process engineers will tell you some types of components are just harder to put on than others. That's just how it is. It's the foundation of the complexity index. A rule of thumb that I got from a process expert I talked to was big, small, or awkward size were the main factors that made for difficult assembly, while capacitors assembled with the high speed machine yielded nearly perfectly.
Walk me through it, step by step!
No. But, this graduate student can.
Have you ever yield modeled?
Yes, when I worked at a PCB assembly facility
Did you find a complexity index?
Yes
Tell me what component types you chose and the yields they predicted!
No
Can you tell me anything interesting?
Everything I've described so far is interesting. When people talk about hybrid yield modeling they, by turn, both over and under complexify it. Trust me, I'm speaking from experience... But, I'll give you a little more... By breaking down the component types, you can find a complexity index. This is interesting in its own right. I thought it was also very interesting is that you can predict the yield of any one board with high accuracy from the other boards without actually building the board in question. If this isn't interesting to you, maybe you just don't get hybrid predictive yield modeling?
Really? That's it?
Yeah, pretty much. You can predict the yield of a future hybrid. You can see if there are any performance outliers. You can use it to calculate an overall facility yield. It could potentially allow you to compare between manufacturing lines. Personally, the biggest benefit that I saw was the peace of mind that it gave to the PCB assembly process owner.
Seriously, that's all?
As far as I know. I haven't seen anything else new on it that specifically pertains to PCB assembly. The same concept has been repeated several times in industry. I have some other ideas, but someone will have to hire this consultant to hear them...
What tools are needed for yield modeling?
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